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This article describes a tester system to automatically test and evaluate the capability of a module and printed circuit (PC) board assembly.
English (United States)
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Tester Bed to Verify the Technology Capability of a Module and Printed
Circuit Board Assembly
This article describes a tester system to automatically test and evaluate the
capability of a module and printed circuit (PC) board assembly.
Referring to the drawing, the tester system consists of three
main units: the cooling and vapor recovery unit, the cooling bath
unit and the control console. The primary function of this system is
to measure and record the following:
1. Voltage fluctuations during simultaneous driver
2. Signal pulse distortion
3. Noise coupling from adjacent signal lines
This data is then evaluated to verify the technology capability of both the
module and PC board assembly.
The cooling bath unit consists of a 150-gallon tank with front and rear doors
which are sealed in the closed position. The module and PC board assembly
(not shown) are mounted vertically to the inside rear door of the tank for easy
removal and replacement. Two independent probe arms that are accurate and
repeatable to plus or minus .0005" are hanging vertically down into the cooling
bath. On the end of the probe arms are yaw assemblies.
Coolant from the main reservoir in the cooling and vapor recovery unit is
pumped into the cooling bath to provide forced convection cooling of the chips
that are mounted to the surface of the modules after power is supplied to the
module and PC board assembly. The cooling system is capable of cooling 500
chips at 25 watts per chip for...