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Novel Technique for Improving Contact Window Slopes Using Bi-Focusing

IP.com Disclosure Number: IPCOM000036091D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Conway, JF Katz, SM Shen, WR Stanasolovich, D Theisen, JF [+details]

Abstract

Positively sloped contact windows or vias are typically used in semiconductor metallurgy to allow subsequent layers of metal to make contact to the underlying circuitry through a passivation layer of dielectric material. The positively sloped sidewalls are necessary to prevent metal cracking over abrupt steps, as shown in Figs. 1 and 2.