Novel Technique for Improving Contact Window Slopes Using Bi-Focusing
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28
Positively sloped contact windows or vias are typically used in semiconductor metallurgy to allow subsequent layers of metal to make contact to the underlying circuitry through a passivation layer of dielectric material. The positively sloped sidewalls are necessary to prevent metal cracking over abrupt steps, as shown in Figs. 1 and 2.