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Browse Prior Art Database

Standoff Attach Tool

IP.com Disclosure Number: IPCOM000036094D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Funk, SG Kolan, HG Winfield, DG [+details]

Abstract

In the manufacture of integrated circuit modules, molded plastic standoffs are frequently placed on several selected module pins to maintain critical distance between the module and the printed circuit board during subsequent processing. Prior efforts at automating the standoff placement were stymied by the small protrusions on the standoffs. Such protrusions are often found on small injection molded plastic parts. The protrusions created difficulties in centering and seating the standoffs against a vacuum finger which was intended to collect the standoff from a bulk supply of standoffs and install the standoffs on a module pin.