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Lead Control in Electroless Nickel-Boron Bath Disclosure Number: IPCOM000036095D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

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Schmeckenbecher, AF Sobon, JT [+details]


A method has been developed for controlling the Pb ion concentration in the Ni-B plating solution used for plating molybdenum lands on multi layer ceramic (MLC) substrates in semiconductor devices. The proposal involves the introduction of Pb molybdate to the bath which ionizes and acts as a buffering agent.