Browse Prior Art Database

Hole Fill of Heavy Copper Power Plane Using Compatible Epoxy Resin Prior to Composite Lamination

IP.com Disclosure Number: IPCOM000036135D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Samuelson, CE [+details]

Abstract

Thick copper power planes are required in order to dissipate heat in applications where high amperage is used. The copper power planes contain clearance holes that must be filled before the power planes are laminated into a composite in order to prevent voids. A method that fills both the clearance holes and the first isolation border is accomplished in the following manner.