Browse Prior Art Database

Use of Silicon-Containing Benzocyclobutene Thermoset Polymer As a Plasma Etchstop in Packaging

IP.com Disclosure Number: IPCOM000036169D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Cain, SR Day, RA Matienzo, LJ Park, JM Wang, DW [+details]

Abstract

This invention relates to the use of a silicon-containing high temperature benzocyclobutene thermoset resin as a plasma etchstop.