Browse Prior Art Database

Use of Silicon-Containing Benzocyclobutene Thermoset Polymer As a Plasma Etchstop in Packaging Disclosure Number: IPCOM000036169D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

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Related People

Cain, SR Day, RA Matienzo, LJ Park, JM Wang, DW [+details]


This invention relates to the use of a silicon-containing high temperature benzocyclobutene thermoset resin as a plasma etchstop.