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Transient Liquid Phase Bonding Process

IP.com Disclosure Number: IPCOM000036182D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Kang, SK Purushothaman, S Woychik, CG [+details]

Abstract

A transient liquid phase (TLP) bonding process for attaching metallized pads on components to a matching set of pads on a carrier is disclosed and comprises: applying by vapor deposition, plating or any other deposition process a metal or alloy coating on one or both of the sets of metal pads to be attached; placing the coated pads in intimate physical contact with each other; heating the coated pads to a temperature above the eutectic temperature of the pad metal-coating or coating- coating combination (whichever is lower), for a sufficient period of time to enable diffusion to occur across the contact interface resulting in the formation of the eutectic liquid, at and near that interface; and cooling the assembly to freeze the eutectic liquid thus forming a strong bond between the pads.