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Browse Prior Art Database

Removal of Heat From Direct Chip Attach Circuitry

IP.com Disclosure Number: IPCOM000036203D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Schrottke, G Willson, DJ [+details]

Abstract

Packaging for high density memory and logic curcuitry is satisfied by packages such as single in-line packages, smart cards, functional islands, daughter cards, etc., typical packages for electronic circuits which are then connected with various means to the system. Direct Chip Attachment (DCA) onto a flexible carrier can be effectively used to accomplish all of these configurations of electronic packaging. (Image Omitted)