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Improved Polishing Techniques for Silicon Wafers

IP.com Disclosure Number: IPCOM000036204D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Esslinger, DC Mauer, JL [+details]

Abstract

A technique is described whereby polishing of dielectric films, during the fabrication of silicon chips, is improved so as not to destroy device structures on the wafers. The concept implements polishing procedures so that small device lands, in a field material, can be maintained intact without undue attack of the field material. (Image Omitted)