Browse Prior Art Database

Thermally Compatible Cap/Heatsink Unit

IP.com Disclosure Number: IPCOM000036205D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
DiPaolo, N Park, CH [+details]

Abstract

A cost-effective cooling and hermetic sealing structure for a semiconductor package (module) is disclosed. The structure, designed to overcome thermal mismatch problems between module cap and substrate materials, maintains a hermetic environment while satisfying all thermal/mechanical requirements.