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Thermally Compatible Cap/Heatsink Unit Disclosure Number: IPCOM000036205D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

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DiPaolo, N Park, CH [+details]


A cost-effective cooling and hermetic sealing structure for a semiconductor package (module) is disclosed. The structure, designed to overcome thermal mismatch problems between module cap and substrate materials, maintains a hermetic environment while satisfying all thermal/mechanical requirements.