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Strain Relief and Card Retention for Duplex Fiber-Optic Packaging Disclosure Number: IPCOM000036211D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

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Related People

Burns, RC DeCarlo, V McLain, HA Howland, SR [+details]


Disclosed is a system for packaging duplex fiber-optic units on a printed circuit card, and the subsequent retention of the card in a card on board package. This system provides for positive card attachment and strain relief of the fiber optics and printed circuit card while providing compensation for thermal expansion within the package.