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Electroforming Stress and Pit-Free Molds From a Boric Acid Additive-Free Sulfamate Nickel Bath

IP.com Disclosure Number: IPCOM000036253D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
DiCenzo, R Guidotti, E Harris, G [+details]

Abstract

Disclosed is a process for electroforming stress and pit-free molds from a low boric acid, additive-free sulfamate nickel bath. In manufacturing an optical media disk, the electroformed nickel stamper plays a key role. The stamper is used in both the injection molding process and the photopolymerization process. The stamper carries the recording information that is transferred to the optical media disk. Therefore, the nickel stamper must be pit- and stress-free to avoid degradation of the recorded information.