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Stress Reliever for Single In-Line Package (Sip) Solder Joints Disclosure Number: IPCOM000036261D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue


Related People

Singh, P Wofford, DC [+details]


Disclosed is a design concept for holding a Single In-line Package (SIP) straight during wave-soldering operation. The design provides strain relief to the solder joints when operators try to straighten a bent SIP. It also provides protection against bending at subsequent assembly and test operations.