Browse Prior Art Database

Stress Reliever for Single In-Line Package (Sip) Solder Joints

IP.com Disclosure Number: IPCOM000036261D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Singh, P Wofford, DC [+details]

Abstract

Disclosed is a design concept for holding a Single In-line Package (SIP) straight during wave-soldering operation. The design provides strain relief to the solder joints when operators try to straighten a bent SIP. It also provides protection against bending at subsequent assembly and test operations.