Browse Prior Art Database

High Density MLC Structure

IP.com Disclosure Number: IPCOM000036406D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Arnold, AF Schmeckenbecher, AF [+details]

Abstract

The process described in this article achieves reliable, inexpensive, fine-line circuitry in multi-layer ceramic (MLC) structures. By the use of a polyamide adhesive layer, copper foil may be laminated onto both sides of green sheet MLC substrate material, thereby allowing for the simultaneous creation of metal patterns on both sides of the sheet through the use of ordinary printed-circuit subtractive processing procedures.