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I/O Pad Design for Preventing In-Process Corrosion of I/O Pads

IP.com Disclosure Number: IPCOM000036408D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29

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McGuire, KM Schmeckenbecher, AF Wildman, HS Merritt, VY [+details]


This article discloses a process for avoiding or minimizing in-process corrosion in the power C-4 (controlled-collapse chip connection) connector pads located on MLC (multi-layer ceramic) substrates.