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NON-Au LOW TEMPERATURE BRAZE ALLOY: Ag-Cu-Sb-(Sn, In)

IP.com Disclosure Number: IPCOM000036427D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Brofman, PJ Marcotte, VC Palmateer, PH [+details]

Abstract

In chip joining during the manufacture of semiconductor modules a braze alloy with a solidus temperature above the 370oC maximum processing temperature is desirable. Available alloys in the 370oC-450oC range are Au-based which adds costs to the manufacturing process. This article proposes alloys based on Sn and/or In additions to an Ag-Cu-Sb eutectic which would provide low-cost, high melting point brazing.