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Composite Circuit Panel Design Features to Minimize Copper Blistering in a Full Additive Plate Process Disclosure Number: IPCOM000036440D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-29

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Bhatt, AC Magnuson, RH Sissenstein, MJ Malek, RW [+details]


This article describes a technique that will prevent the formation of copper blisters on the external mounting plane areas of composite circuit panels fabricated with the full additive plate process.