The following operators can be used to better focus your queries.
( ) , AND, OR, NOT, W/#
? single char wildcard, not at start
* multi char wildcard, not at start
(Cat? OR feline) AND NOT dog?
Cat? W/5 behavior
(Cat? OR feline) AND traits
Cat AND charact*
This guide provides a more detailed description of the syntax that is supported along with examples.
This search box also supports the look-up of an IP.com Digital Signature (also referred to as Fingerprint); enter the 72-, 48-, or 32-character code to retrieve details of the associated file or submission.
Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
Concept search eliminates the need for complex Boolean syntax to inform retrieval. Our Semantic Gist engine uses advanced cognitive semantic analysis to extract the meaning of data. This reduces the chances of missing valuable information, that may result from traditional keyword searching.
This article describes a technique that will prevent the formation of copper blisters on the external mounting plane areas of composite circuit panels fabricated with the full additive plate process.
English (United States)
This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
77% of the total text.
Page 1 of 2
Composite Circuit Panel Design Features to Minimize Copper Blistering in
a Full Additive Plate Process
This article describes a technique that will prevent the formation of copper
blisters on the external mounting plane areas of composite circuit panels
fabricated with the full additive plate process.
Circuit boards fabricated with the full additive plate process * are subject to
the formation of copper blisters when a sufficiently large area of copper is being
plated. These copper blisters are characterized by the formation of a bubble and
failure at the copper/ epoxy interface. This problem limits the design of pattern
dimensions and can cause panels to be scrapped for blistering in critical areas,
such as capacitor pads on external mounting planes. The blister formation is
associated with the evolution of gas during additive plating and the physical
constraint of this gas by the layer of copper being deposited.
This blistering can be ameliorated by the Z direction construction of the
printed circuit board, rather than the X-Y considerations used heretofore in the
pattern design. This relationship is demonstrated in Fig. 1. A dielectric thickness
of 8 mils for a pad dimension of 150 mils X 100 mils results in a blistering
frequency of 60%. A dielectric thickness of 11 mils will, however, reduce the
blistering frequency to 14%.
A second approach to using Z direction construction is to employ pilot holes
in power plane areas directly underneath su...