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Browse Prior Art Database

Thermal Control Hardware for Accelerated Run-In Testing of Multi-Chip Modules

IP.com Disclosure Number: IPCOM000036498D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Digugno, NJ Edwards, DL Zumbrunnen, ML Mack, GH [+details]

Abstract

A TCM (thermal conduction module) hat design is modified to provide a manufacturing tool for testing circuit modules before they are assembled as part of completed TCMs. In a TCM, semiconductor chips are arrayed on a planar chip supporting substrate. A hat cooperates with the substrate to form an enclosure for the chips, and pistons that are carried in cylindrical holes in the hat contact the chips and conduct heat to the hat, which is cooled by water.