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Means of Removing More Heat From a TCM (Or Other Liquid-Cooled Logic Package) by Reducing the Coolant Temperature

IP.com Disclosure Number: IPCOM000036505D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Vasile, VC [+details]

Abstract

The coolant temperature in a liquid-cooled logic package is limited to the dew point of the room air. Attempts to cool the logic to a lower temperature will cause condensation to form on the logic package and the pipes distributing the coolant throughout the machine. To eliminate this problem and allow much lower coolant temperatures, the TCM top hat, formed into a proper heat sink, can be immersed in a suitable coolant. The coolant is contained in an insulated vessel and is kept at the proper temperature by having the heat exchanger of a refrigeration unit immersed in the coolant. Circulating through the heat exchanger is a refrigerant, such as FREON*.