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An array plate is used as a placement device for locating individual solder rings on each pin of a multiple pin electrical connector prior to soldering. The device works as follows.
English (United States)
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Solder Ring Placement for Multiple Pin Electrical Connector
An array plate is used as a placement device for locating individual solder
rings on each pin of a multiple pin electrical connector prior to soldering. The
device works as follows.
The device is shown in Fig. 1. It consists of a feed mechanism 1, that is
mounted on an array plate 2. The array plate 2 has four steps
or tiers (the number of rows of pins on which the solder rings are to be placed),
seen in the end view of Fig. 2. Each tier has a series of locating nests 3
distributed evenly along the four-tier array plate 2, where solder rings 4 are held
prior to placement onto the connector pins (not shown). The array plate is
movable along an axis indicated by the arrows (Fig. 1), while the feed
mechanism has a fixed mounting.
In Fig. 3, a cross-section view of the feed mechanism 1, solder rings 4 are
fed from vibratory, centrifugal, or other suitable bowl feeder (not shown) into a
chute 5 where solder rings are delivered to feed mechanism where rings are
stacked. As shown in Fig. 2, an end view of the feed mechanism, four separate
chambers of the feed mechanism contain four stacks of solder rings. The four
feed mechanism chambers correspond to the four tiers on the array plate. The
rings are fed by gravity into the multiple slots 6 (Fig. 3) of the array plate by the
reciprocating motion of the array plate as it moves under the feed mechanism.
Slots 6 (Fig. 5) are provided to correspond with each row of pins on the electrical
connector being ringed.
The individual slots or nests are dimensioned such that only one ring may
enter each slot. The spacing of the slots is arranged to match the array of pins
on the connector. Each nest holds the solder ring in the pro...