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Surface-Mounted Component Place and Bond Apparatus Disclosure Number: IPCOM000036584D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

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Cook, LD Gill, EJ Habich, AB Hermann, K Jenkins, WM Whitehead, VE Hunt, RE [+details]


An apparatus is described for the gang placement and soldering surface mount components on a circuit board. Existing equipment and techniques use a variety of serial operations. These usually include solder screen pasting, single chip placement and reflow processes for soldering. This device does all these operations in one station. The advantages are lower capital expense, less floor space required, faster output and higher reliability.