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Device for Planarizing Structured Surfaces

IP.com Disclosure Number: IPCOM000036597D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Boettiger, U [+details]

Abstract

Lithographically structured surfaces, for example, of semiconductor substrates, frequently have a substantial three-dimensional topography. As a result of the limited depth of focus of presently used high-resolution optical exposure devices, such surfaces cannot be accurately structured any further until after they have been planarized by an additive method providing for a curable and/or moldable compound, such as a polyimide or a photoresist, to be deposited and cured between the surface to be treated and an absolutely planar ram. After withdrawal of the ram, a planar surface is obtained.