Device for Planarizing Structured Surfaces
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
Lithographically structured surfaces, for example, of semiconductor substrates, frequently have a substantial three-dimensional topography. As a result of the limited depth of focus of presently used high-resolution optical exposure devices, such surfaces cannot be accurately structured any further until after they have been planarized by an additive method providing for a curable and/or moldable compound, such as a polyimide or a photoresist, to be deposited and cured between the surface to be treated and an absolutely planar ram. After withdrawal of the ram, a planar surface is obtained.