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Low Cost Seeding of Polyimide for Electroless Metal Deposition

IP.com Disclosure Number: IPCOM000036641D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Buchwalter, LP Buchwalter, SL Goldberg, M Kovac, CA Sambucetti, C Viehbeck, A Thomas, RR [+details]

Abstract

Polyimides are a group of organic polymers that have gained widespread use in the electronics industry as an interlayer dielectric. Shown in Fig. 1 is a typical polyimide polymer (pyromellitic dianhydride-oxydianiline (PMDA-ODA)). Polyimide polymers are characterized by their excellent thermal and mechanical properties. However, the surface of these materials does not make them readily amenable to bonding with metals (e.g., copper) of interest to the electronic industry. With the notable exception of chromium, sputtering or electron beam evaporation of these metals onto polyimide surfaces usually results in low adhesion of the deposited films. The low adhesion is thought to arise from the lack of interaction of the deposited metal with functional groups on the polymer surface.