Browse Prior Art Database

Thermal Conduction Module With Interleaved Plates Having Variably Aligned or Non-Aligned Windows to Compensate for Variations in Chip Height

IP.com Disclosure Number: IPCOM000036642D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Chu, RC Simons, RE [+details]

Abstract

Some circuit modules have semiconductor chips mounted in an array on a thin flat substrate that for purposes of terminology is arbitrarily positioned in a horizontal plane with the chips on the upper surface. Apparatus called a hat overlies the chips and cooperates with the substrate to form an enclosure for the chips. Metal components are spring-loaded to contact the upper surface of the chip and conduct heat from the chips to the hat. The hat is cooled with chilled water.