Browse Prior Art Database

Via Filling Method for Injection Molded Boards

IP.com Disclosure Number: IPCOM000036685D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Cirzeveto, V Funari, J Sariti, SS Smey, SL [+details]

Abstract

Disclosed is a process that provides a low cost metallized through- hole for an injection molded board.