Pulsed Electroplating of Superconducting Films From Non-Aqueous Solutions
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
This disclosure describes the concept of electrochemical deposition of superconducting films with the nominal stoichiometry YBa2 Cu3 O(9-d) (d=2.1). There are sufficient adjustable parameters such that the composition of the deposit may be varied over a relatively broad range. The basic idea involves the pulsed current or potential deposition of the metals from an aprotic solvent containing prerequisite quantities of the metal salts or metal complexes. The metals are deposited under anaerobic conditions to produce a thin film of the metals with the proper stoichiometry. The film is then allowed to come in contact with oxygen, under carefully controlled conditions, to achieve the oxide structure *.