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Punch Design for Magnetic Punch

IP.com Disclosure Number: IPCOM000036716D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Long, DC Weiss, G [+details]

Abstract

A modification has been proposed for the punch heads used for punching green sheets used in multilayer ceramic (MLC) semiconductor devices. The proposal calls for coining of the normally flat punchhead which results in an extended operating life and improved performance of the punch.