Self-Aligning Memory Module
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29
The self-aligning memory module (SAMM) is a first level integrated circuit package that is uniquely suited for packaging memory devices such as DRAMs and SRAMs due to the large rectangular wafer size and the small number of input/output connections that are characteristic of these devices. The advantage of the SAMM package compared to conventional plastic packages used for memory devices (PDIP, SOP, SOJ, and ZIP) is the increase in packaging density due to the edge-mount configuration with surface-mounted, fine-pitch lead spacing. The self- aligning feature improves the accuracy of aligning the fine pitch leads with the circuitry on the printed circuit board using conventional pick and place equipment.