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Sealing System for Silicon Carbide Rods Disclosure Number: IPCOM000036722D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Perinet, JB [+details]


The present disclosure aims to improve sealing between the cantilever or quartz door and the rod to avoid HCl or dopant (BBr3) leakage during high temperature steps, such as diffusion/oxidation in the standard semiconductor manufacturing process.