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Ceramic Substrate Reclamation Process

IP.com Disclosure Number: IPCOM000036751D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Carhart, RA Chao, RS Redpath, DL Hammer, RB [+details]

Abstract

Metallized ceramic substrates, having defective metal conductors on a dielectric of glass, polyimide or aluminum trioxide and connected by vias with an underlying metal ground or voltage plane, can be reclaimed by first protecting the vias, then etching off the top metal layer and reconstructing the removed conductors.