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Browse Prior Art Database

Substituting FULLY CURED DIELECTRIC for PREPREG at the COMPOSITE Lamination Level

IP.com Disclosure Number: IPCOM000036775D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Bhatt, AC Magnuson, RH Sissenstein, MJ Malek, RW [+details]

Abstract

Disclosed is a method of building internal plane printed circuit boards that eliminates up to 85% of the dimensional instability that happens in the composite lamination process.