Method for Forming Wiring Patterns and Vias on a Variety of Substrates
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
This article describes a new method of defining wiring patterns and vias with pure metals or metallic alloys on various ceramic greensheets, pressed and fired ceramic substrates, or polymer surfaces. The disclosed procedure has a capability for obtaining higher resolution wiring patterns by lithography of finer dimensions than that obtainable through the use of conventional screening techniques.