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Improved Process for Incorporation of Metal Pattern (Circuitry) Decals Into Multi-Layer Ceramic Substrates

IP.com Disclosure Number: IPCOM000036851D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Acocella, J Casey, JA Dynys, J [+details]

Abstract

This article concerns an improved means for incorporating solid metal line patterns (circuits) into existing multi-layer ceramic (MLC) substrate manufacturing processes.