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This article concerns an improved means for incorporating solid metal line patterns (circuits) into existing multi-layer ceramic (MLC) substrate manufacturing processes.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
55% of the total text.
Page 1 of 2
Improved Process for Incorporation of Metal Pattern (Circuitry) Decals Into
Multi-Layer Ceramic Substrates
This article concerns an improved means for incorporating solid metal line
patterns (circuits) into existing multi-layer ceramic (MLC) substrate manufacturing
Existing procedures for transferring a decal-like, fine-line, metal circuit pattern
from a carrier to a "green" laminate involve the use of heat and pressure in a
lamination press and contribute to the lack of a complete metal line enclosure in
the fired laminate. An alternative technique is to cast the green ceramic slurry
onto and about the metallization pattern. However, both gaps or voids found
along the edges of the metal line parallel to the direction of applied pressure and
significant shear stresses are noted to arise during the processes, leading to line
pattern distortion and/or breakage.
The disclosed procedure avoids these problems by:
1) providing more uniform glass-ceramic particle
packing along circuit patterns which yields complete
metal enclosure within the fired ceramic,
2) eliminating shear stresses during the transfer of
the metal pattern decal into the green sheet or
laminate. This is accomplished by employing the
developed decal metallurgy on its carrier as the
carrier for the formation of greensheets or laminates.
The (modified) MLC slurry is sprayed directly onto the
decal/carrier. Greensheet/decals of 1.5 to 6.0 mils
thickness can be made with this process.
The disclosed process provides for:
1) the desired uniform packing of particles around