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Eliminating Oil Canning on Hot Oil Reworked Assemblies

IP.com Disclosure Number: IPCOM000036910D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Agnew, RH Dabkowski, KJ Sackett, CH Franchak, NP [+details]

Abstract

The following technique eliminates oil canning on multi-layered printed circuit boards such as an assembly consisting of four signal planes and two power planes. Hold-down bars (HDBs), shown in Fig. 2, and heat-dissipating masses (HDMs), shown in Fig. 3, are key items to the solution of this problem.