One-Step Laser Diode Die-Bonding Method
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
With hitherto applied methods and apparatus, a conductive organic flux substance is used for laser diode bonding. During heat treatment, this results in the deposition of a film of organic substance on the laser mirror, thereby deteriorating the performance of high-quality devices. This can be avoided with the herein described one-step bonding method employing an eutectic compound.