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One-Step Laser Diode Die-Bonding Method

IP.com Disclosure Number: IPCOM000036931D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Richard, H [+details]

Abstract

With hitherto applied methods and apparatus, a conductive organic flux substance is used for laser diode bonding. During heat treatment, this results in the deposition of a film of organic substance on the laser mirror, thereby deteriorating the performance of high-quality devices. This can be avoided with the herein described one-step bonding method employing an eutectic compound.