In Situ Multilevel Resist Polysilicon Etch Process
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
By changing etch gas and electrical connections to elements internal to an etching tool, materials in a multilayer stack are etched at controlled relative rates and degree of anisotropy. The technique may be used to create features smaller than normal photo-limited size.