Browse Prior Art Database

Roll Acid Plate Mechanism

IP.com Disclosure Number: IPCOM000037004D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Lee, JL Moreno, OA Yuhasse, WA [+details]

Abstract

Disclosed is a mechanism for continuous copper electroplating of a sheet of KAPTON* which is covered with a thin chromium layer and a seed layer of copper. This mechanism electroplates a copper layer up to 1.4 to 2.0 thousandths of an inch thick.