Roll Acid Plate Mechanism
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Disclosed is a mechanism for continuous copper electroplating of a sheet of KAPTON* which is covered with a thin chromium layer and a seed layer of copper. This mechanism electroplates a copper layer up to 1.4 to 2.0 thousandths of an inch thick.