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High-Density Optical Fiber Arrays for Optoelectronic Devices

IP.com Disclosure Number: IPCOM000037018D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Cina, M Oprysko, MM Rand, R Fan, B [+details]

Abstract

Methods for densely packing fibers on a scale compatible with integrated semiconductor devices are disclosed. The communication-industry standard high-bandwidth optical fibers have core diameters of 50 mmm or 62.5 mm for multi-mode fibers and of N8 mm for mono-mode fibers. Both have an outer (cladding) diameter of 125 mm which limits the density of fibers which can be interfaced with integrated optoelectronic devices. High-density fiber arrays can be fabricated by using optical fibers whose cladding has been partially removed with a suitable etchant, such as buffered hydrofluoric acid. To minimize the coupling (crosstalk) among bundled fibers, a cladding thickness of N10 mm for monomode fibers and N15 mm for multimode fibers, respectively, should be left around the core.