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Off-Chip Electrostatic Discharge Protection Disclosure Number: IPCOM000037081D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

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Colt, J [+details]


When silicon integrated circuit chips are mounted on a silicon wiring substrate, electrostic protective devices, e.g., diodes and resistors, are incorporated in the wiring substrate instead of in the integrated circuit chip. Thus, protective devices can be optimized for superior electrostic discharge (ESD) protection and space is saved on the integrated circuit chip.