Browse Prior Art Database

Off-Chip Electrostatic Discharge Protection

IP.com Disclosure Number: IPCOM000037081D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Colt, J [+details]

Abstract

When silicon integrated circuit chips are mounted on a silicon wiring substrate, electrostic protective devices, e.g., diodes and resistors, are incorporated in the wiring substrate instead of in the integrated circuit chip. Thus, protective devices can be optimized for superior electrostic discharge (ESD) protection and space is saved on the integrated circuit chip.