Browse Prior Art Database

Process for Forming a High-Aspect-Ratio Solder Interconnection

IP.com Disclosure Number: IPCOM000037094D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Greer, SE Howard, RT Millham, EE [+details]

Abstract

A process is described for fabricating tall columns of deposited solder on chips or substrates to create non-reflowed and fatigue-resistant solder interconnections, and allow for direct chip attachment (DCA) applications.