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Process for Forming a High-Aspect-Ratio Solder Interconnection Disclosure Number: IPCOM000037094D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Greer, SE Howard, RT Millham, EE [+details]


A process is described for fabricating tall columns of deposited solder on chips or substrates to create non-reflowed and fatigue-resistant solder interconnections, and allow for direct chip attachment (DCA) applications.