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Disclosed is a method that makes it possible for the inspection and rework of a module that contains one or more overhanging members such as a heat sink.
English (United States)
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Removable Module Heat Sink for Inspection and Rework
Disclosed is a method that makes it possible for the inspection and rework of
a module that contains one or more overhanging members such as a heat sink.
The increasingly higher powers for air-cooled logic modules in surface mount
technology (SMT) has made it necessary to use attached heat sinks that are
optimized for their particular application. As an example, the module/heat sink
assembly shown in the figures has overhanging members to increase the total
surface area of the heat sink and thus provide better cooling. Fig. 1 is a side
view, and Fig. 2 is a top view. Use of overhanging members, however, makes
SMT assembly and rework almost impossible. In addition, the module cap and
heat sink are conventionally either a one-piece integral part or are epoxied
To enhance thermal performance and also meet the SMT assembly and
rework requirements, it is necessary that the heat sink be mounted after SMT
assembly of the module and be easily removed during rework operation of the
module. Low temperature solder can be used to attach the sink to the cap.
Solder has a higher thermal conductivity than epoxy and thus the interface
resistance between the heat sink and module cap will be reduced. To allow
uniform air heating and, thus, easy removal of the sink, slots may be cut in the
heat sink base (see the figures).
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