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A sacrificial coating is applied prior to logic testing and laser blowing of metal fuses, eliminating the need for "clean-up" of the splatter that results from blowing fuses.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
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Method for Eliminating Laser Splatter Concerns Resulting From the
Deletion of Fuses in Semiconductor Logic
A sacrificial coating is applied prior to logic testing and laser blowing of metal
fuses, eliminating the need for "clean-up" of the splatter that results from blowing
Semiconductor logic generally uses multi-level wiring schemes, and it
becomes impossible to blow polysilicon fuses after testing with a laser due to the
thick multi-level insulation over the polysilicon level. Therefore, metal fuses are
used; however, this technique requires a "clean-up" process following fuse
For passivated fuses, a thick insulation over the metal fuse areas is "opened-
up" at the same time metal pads are defined in the final insulator passivation of
the chip. When cleaning up residual metal to eliminate splatter-created shorts
after blowing fuses, the final level metal pads are attacked. This concern may
require a two mask process, i.e., a separate mask to protect the final level pad
metal during "clean-up". Blowing final level unpassivated fuses is not currently an
option because metal splatter may cause unwanted shorts and the splatter can
not be removed without affecting all other metal pads, lines and unblown fuses. A
technique is described for fixing this problem.
Through the application of a spin-applied photoresist or glass after final
insulator passivation, via definition etch and before a wafer is sent to test, a
sacrificial coat approximately 2,000...