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ZIF Interposer Board for TCM to Clark or Other Similar Applications Disclosure Number: IPCOM000037130D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Grebe, KR Palmer, MJ Shaw, JM [+details]


Disclosed is an interposer which acts as a zero insertion force (ZIF) connector between a thermal conduction module (TCM) and Clark Board, allowing the contacts to be placed on a .012 X .030 inch matrix. The design allows the connections to be made in an environment that would not normally be conducive with mating flat surfaces.