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Pulse Plating of Alloys

IP.com Disclosure Number: IPCOM000037144D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Bindra, P Galasco, RT White, JR [+details]

Abstract

This article describes a method to pulse electroplate alloys with simplified bath chemistry minimizing the usage of additives. The bath chemistry consists of a solvent, supporting electrolyte, and soluble metal salts or complexes in solution. The alloy is electroplated by pulsing potentials from E0, potential where no plating takes place, to E2 for metal 1 deposition and then E3 for mainly metal 2 deposition (see Figs. 1 and 2). This method has sufficient adjustable parameters (E2, E3, t2, t3, frequency) to control the deposit composition over a wide range and still yield acceptable grain structure and deposit finish.