Deco Etch Process for Determining the Etch Effect on Thin Films in Small Holes
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Prior-art processes do not allow determining the etch effect on, e.g., the amount of titanium silicide removed from contact holes of about 1 mm diameter by etching. By means of the RIE (reactive ion etch) deco process described in this article, the amount of material removed can be readily determined at high speed.