Browse Prior Art Database

Deco Etch Process for Determining the Etch Effect on Thin Films in Small Holes

IP.com Disclosure Number: IPCOM000037150D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Koblinger, O Sailer, E [+details]

Abstract

Prior-art processes do not allow determining the etch effect on, e.g., the amount of titanium silicide removed from contact holes of about 1 mm diameter by etching. By means of the RIE (reactive ion etch) deco process described in this article, the amount of material removed can be readily determined at high speed.