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Additive Plating on Chromium for Circuitizing Non-Epoxy Substrates

IP.com Disclosure Number: IPCOM000037151D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
McHatton, RC [+details]

Abstract

Disclosed is a process for circuitizing non-epoxy substrates, such as alumina ceramics or polymer thin films, whereby copper is plated in an additive process onto a conductive layer of vacuum deposited chromium while simultaneously removing the chromium oxide layer and its application to the circuitization of substrates which show chromium selective adhesion, such as alumina ceramics, polyimide and fluorinated polymer films.