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Disclosed is a decoupling capacitor designed for direct attachment to the solder ball pads of an integrated circuit (IC) chip. Both the design and process and materials of fabrication are described.
English (United States)
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Directly Attached Decoupling Capacitors and Fabrication Process
Disclosed is a decoupling capacitor designed for direct attachment to the
solder ball pads of an integrated circuit (IC) chip. Both the design and process
and materials of fabrication are described.
The figure shows a cross-sectional view of an integrated circuit chip having
solder ball connection terminals attached to a thin, flexible printed circuit carrier
similar to that described in U.S. Patent 4,231,154, and having attached by solder
ball terminals to the under side, a flat, thin film multi-element decoupling
capacitor. The details of the geometry and connections of the capacitor are
determined by the number of power voltage levels required by the IC chip and
the associated solder ball connections provided.
The capacitor is made on a substrate having mechanical rigidity, electrical
insulating and thermal expansion and stability properties suitable for the purpose.
Silicon and certain ceramics and glasses are examples of acceptable materials.
A first metallization, preferably of copper, is applied by any number of available
processes, such as evaporation or sputtering, thus forming the ground or
reference plate of the capacitor.
The dielectric layer is formed by one of several processes also, and a variety
of materials may be selected for this layer. One possible choice is barium
titanate applied by screen printing followed by sintering to remove organic
binders and develop the desired high diel...