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Directly Attached Decoupling Capacitors and Fabrication Process

IP.com Disclosure Number: IPCOM000037153D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Mukerjee, SP Snyder, KA [+details]

Abstract

Disclosed is a decoupling capacitor designed for direct attachment to the solder ball pads of an integrated circuit (IC) chip. Both the design and process and materials of fabrication are described.