Browse Prior Art Database

Design for Minimum Chip Joint Stress

IP.com Disclosure Number: IPCOM000037225D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Niu, TM Wiley, JP [+details]

Abstract

Chip joints are subject to thermal stress during machine cycling because of the difference in thermal expansion coefficient between the chip and the substrate. The effect is reduced by incorporation of low expansion plates, but this technique is only partially successful because the expansion coefficient of the substrate cannot be reduced to that of the chip with any practical combination of materials.