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Etching Dielectric Materials for Copper Interconnects

IP.com Disclosure Number: IPCOM000037236D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Hu, CK Pearson, DJ Small, MB [+details]

Abstract

A technique is described whereby a materials set and process is implemented for copper interconnects in VLSI circuits so as to eliminate Cu oxidation when building two or more levels.