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Improved Lift-Off Process for Fabricating Metal Studs (On Semiconductor Substrates)

IP.com Disclosure Number: IPCOM000037246D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Greco, NA Greco, SE [+details]

Abstract

An improvement in existing processes for lift-off of fine structures, such as metal studs, is described in this article. The disclosed procedure employs the inverted lift-off technique to lift off metal but avoids problems related to long ashing of the underlaying material by use of a second solvent to effect its removal.